enmech - Enabling mechatronic foil innovations. Freudenberg Group.

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Why you can rely on our products

Because our processes secure the highest quality

Why you can rely on our products

Because our processes secure the highest quality

Why you can rely on our products

Because our processes secure the highest quality

Content

Flexible printed circuit boards - our FPC processes

Flexible printed circuits (FPC) are the basis of our mechatronic products. The films used in FPC technology are usually around 25-75 microns thin and are flexible sheets of PET (polyester = polyethylene terephthalate), PEN (polyethylene naphthalate) or PI (polyimide) material that are laminated to copper sheets with a thicknesses of 18-105 microns. The copper conductor image is produced by an etching process in a highly economical roll-to -roll process. It is no problem for us to produce single layer circuits with a size of 100 cm x 50 cm. With our high-precision manufacturing processes, we can realize trace widths of down to 0.1 mm.

If required enmech can tin-plate the copper trace image, to provide an excellent surface for soldering processes. As an alternative to the copper etching process enmech also offers flexible PET or PEN printed circuit boards in silver ink (conductive paste) technology.


 

After the etching enmech continues production in an efficient roll-to -roll process. The copper foil laminate is then covered by a secondary lamination process with another PEN or PET layer. This provides the FPC with moisture resistance and electrical insulation. Alternatively or additionally, a topcoat lacquer can be printed onto the copper. This lacquer, available in various colors, can be printed to cover all of the copper, or only partially if needed.

Openings can be (rotationally) punched into the cover sheet depending on the tolerance requirements or can be facilitated by tool-free laser procedures. Where there are particularly strict tolerances requirements single cover film sheets are highly precisely aligned and laminated with high precision to the copper foil substrate.

 

 

 

 

 

 

 


Although our flexible circuit boards already follow almost any three-dimensional structure, there is also the option to shape the films to suit your individual needs by means of cold and hot forming processes.

Finally our extensive test equipment inspects the circuit boards 100 percent for continuity and short circuits.

We have summarized for you the next steps towards a mechatronic product under the section "FPCplus".

Etching of copper layout
Lamination of cover foil in role-to-role process
Lamination of cover foil
Electrical test of FPC